Label-Free Evaluation of Cell Viability Using PICS
PICS provides a rapid and accurate estimation of cell viability using a label-free technique, avoiding destructive fixation and staining.
Large Area Sample Preparation for Electron Backscatter Diffraction Analysis – EBSD
Large area EBSD sample preparation by broad ion beam milling BIB milling that offers uniform sample milling up to 50 mm in diameter.
Oilseed Analysis Using NMR – Nuclear Magnetic Resonance Spectroscopy
Oilseed Analysis Rapid, and in some cases, non-destructive measurement of oil or oil and moisture in oilseeds and oilseed residues is important for breeding, trading and processing purposes. NMR is ...
DENSsolutions Introduce New Liquid Supply System (LSS) for Liquid Phase Electron Microscopy
DENSsolutions have introduced the next evolution in LPEM, with their new Liquid Supply Systems (LSS).
The Ideal MicroCT for Core Facility Labs – Combining Versatility and Performance
The TESCAN UniTOM HR is the ideal microCT for core facility labs combining speed, resolution, performance, versatility & dynamic CT.
Multitechnology Biofabrication Unlocking Challenges of Functional Tissue Manufacturing
The use of a multitechnology biofabrication platform can be used to overcome current challenges in bioprinting and regenerative medicine.
3D Bioprinting with Single Cell Precision for the Construction of Tissue and Disease Models
This presentation addresses high-precision bioprinting of tissue and disease models using Biopixlar, a system based on microfluidic technology. It enables users to place single cells with single cell precision/ high-precision ...
Introduction to the NGB-R, a Disruptive 4D Bioprinting System
This webinar delivers a wealth of information on bioprinting & serves as an excellent introduction to the Poietis NGB-R 4D bioprinting system
Overcoming the Resolution Limits in 3D Bioprinting
This presentation looks at technology that allows you to 3D bioprint structures smaller with resolution down to 170nm at surprising speeds.
Millimeter-Scale, Large Uniform Area Semiconductor Device Delayering for Physical Failure Analysis and Quality Control
Semiconductor device delayering by broad argon ion beam milling [TrionMill, Fischione Instruments] offers effective milling area of 50mm