TESCAN AMBER X 2 – Plasma FIB-SEM

Redefining plasma FIB-SEM

Combining the speed of a plasma FIB with the resolution of a Ga FIB

  • Key Features

    • Automation – Highest levels of milling and imaging automation
    • AutoPrep Pro™ - Completely automates the entire the TEM sample prep process
    • 3D characterisation – Easily combine 3DEDS, 3DEBSD and ToF-SIMS datasets
    • Field-free UHR SEM – Maximum versatility and image quality
    • Essence user interface - Fully customisable and user-friendly layout

TESCAN, in collaboration with Orsay Physics, have designed the TESCAN AMBER X 2, a groundbreaking plasma FIB-SEM system designed to set new standards for materials science research. This state-of-the-art technology offers unmatched resolution, throughput, and versatility for comprehensive sample preparation and characterisation. These capabilities and versatility make it the perfect system for multi-user facilities and central laboratories

The TESCAN AMBER X2 represents a revolutionary advancement in Focused Ion Beam Scanning Electron Microscopes (FIB-SEMs), seamlessly blending the precision of Ga FIB-SEMs with the efficiency of plasma FIB-SEMs. This innovative solution delivers unparalleled resolution, making plasma FIB utilisation as effective as Ga FIB-SEM. It also enables rapid large-scale milling, facilitating the acquisition of high-quality, multimodal 2D and 3D statistical data acquisition from areas as large as hundreds of micrometers.

MISTRAL Plasma FIB Column

Developed by Orsay Physics, the new MISTRAL plasma FIB column, optimising beam parameters for superior beam profiles, simplifying workflows and improving precision, beam placement accuracy at low ion beam energies and milling performance.

BrightBeam SEM Column

TESCAN’s BrightBeam™ field-free SEM column offers ultra-high-resolution imaging capabilities for metallic, magnetic, non-conductive, charging, and beam-sensitive specimens, providing accurate analysis – even at low keV. It also offers industry leading wide field of view and various scanning modes. Users will also appreciate multimodal and multiscale materials characterisation capabilities, providing an all-encompassing solution for researchers.

Multimodal and Multiscale Analysis

The TESCAN AMBER X 2 fully integrates unique 3D methods like 3D ToF-SIMS for detailed elemental composition analysis, crucial in applications such as next-generation battery research, as well as 3DEDS and 3DEBSD

  • All
  • Additive Manufacturing
  • AFM/SPM/SNOM
  • ARPES
  • Automated Mineralogy
  • Biological Microscopy
  • Bioprinting
  • CL
  • CLEM
  • Computed Tomography
  • Computed Tomography - Life Sci
  • Diffraction Imaging
  • Digital Microscopy
  • EBSD
  • EDS
  • Electron Beam Lithography (EBL)
  • Electron Microscopy
  • Fabrication
  • FIB
  • Fluorescent Microscopy
  • Hyperspectral
  • In situ
  • Laser spectroscopy
  • Light Microscopy
  • Micro XRF
  • Microfluidic Bioprinters
  • Microscopy
  • Radiography
  • Raman
  • SEM
  • Spectroscopy
  • Super Resolution Microscopy
  • TEM
  • Thermal Probe Lithography
  • WDS
  • X-ray Imaging
  • X-ray Microscopy